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HIGH VALUE MULTILAYER CERAMIC CAPACITORS
BJ BJ OPERATING TEMP. F X7R X5R F Y5V K25VJ85C K55VJ125C K55VJ85C K25VJ85C K30VJ85C
FEATURES
Y Ni YThe use of Nickel(Ni) as material for both the internal and external electrodes improves the solderability and heat resistance characteristics. This almost completely eliminates migration and raises the level of reliability significantly. YLow equivalent series resistance(ESR) provides excellent noise absorption characteristics. YCompared to tantalum or aluminum electrolytic capacitors these ceramic capacitors offer a number of excellent features, including: Higher permissible ripple current values Smaller case sizes relative to rated voltage Improved reliability due to higher insulation resistance and breakdown voltage.
Y Y Y Y
fESRg
APPLICATIONS
Y Y YGeneral digital circuit YPower supply bypass capacitors Liquid crystal modules Liquid crystal drive voltage lines LS I, I C, converters(both for input and output) YSmoothing capacitors DC-DC converters (both for input and output) Switching power supplies (secondary side)
LSI Y DC-DC f f2
IC
OP g g
ORDERING CODE
1
fVDCg
A J L E T G U 4 6.3 10 16 25 35 50
3
K
5
fLg
QF BJ M 30 80 M10 QW
7
K M Z M10 M20 M 80 20 % % %
9
K
4
fEIAgLPWfmmg
107f0603g 212f0805g 316f1206g 325f1210g 432f1812g 550f2220g 1.6P0.8 2.0P1.25 3.2P1.6 3.2P2.5 4.5P3.2 5.7P5.0
6
473 105
10
B T f g
fpFg
47,000 1,000,000
8
fmmg
A D F G H L N M 0.8 0.85 1.15 1.25 1.5 1.6 1.9 2.5
w
w
2
11
Q QW
w
1
M
. J DM K 3 1 6 B J 1 0 6 M L _ T Z
1
at
2
Rated voltagefVDCg
A J L E T G U 4 6.3 10 16 25 35 50
aS
3
4 3
5 5
6 7
7
8
9 9
10
11
he
K
End termination
Plated
Temperature characteristics code
QF BJ Y5V X7R X5R K30VJ85C J22NK82L K55VJ125C M15L K55VJ85C M15L QWBlank space
Capacitance tolerancesfLg
K M Z M10 M20 M 80 20
Special code
K Standard products
4
Dimensions(case size)fmmg
107f0603g 212f0805g 316f1206g 325f1210g 432f1812g 550f2220g 1.6P0.8 2.0P1.25 3.2P1.6 3.2P2.5 4.5P3.2 5.7P5.0
et
10
Packaging
B T Bulk Tape & reel
2
Series name
M Multilayer ceramic capacitors
4U
BJ
8
Thicknessfmmg
A D F G H L N M 0.8 0.85 1.15 1.25 1.5 1.6 1.9 2.5
6
Nominal capacitancefpFg
example 473 105 47,000 1,000,000
.c
11
Internal code
Q Standard products QWBlank space
om
38
www..com
EXTERNAL DIMENSIONS
TypefEIAg GMK107 (0603) GMK212 (0805) 1 2 L 1.6M0.10 f0.063M0.004g 2.0M0.10 f0.079M0.004g W 0.8M0.10 f0.031M0.004g 1.25M0.10 f0.049M0.04g T 0.8M0.10 f0.031M0.004g 0.85M0.10 f0.033M0.004g 1.25M0.10 f0.049M0.004g 0.85M0.10 f0.033M0.004g 1.15M0.10 f0.045M0.004g 1.25M0.10 f0.049M0.004g 1.6M0.20 f0.063M0.008g 0.85M0.10 f0.033M0.004g 1.15M0.10 f0.045M0.004g 1.5M0.10 f0.059M0.004g 1.9M0.20 f0.075M0.008g 2.5M0.20 f0.098M0.008g 2.5M0.20 f0.098M0.008g 2.5M0.20 f0.098M0.008g A D G D F G L D F H N M M M 0.9M0.6 f0.035M0.024g 0.3V2.0 f0.012V0.079g 0.6M0.3 f0.024M0.012g 0.50000 K0.25 f0.020J0.014g K0.010
J0.35
e 0.35M0.25 f0.014M0.010g 0.5M0.25 f0.020M0.010g
GMK316 (1206)
3.2M0.15 f0.126M0.006g
1.6M0.15 f0.063M0.006g
4
CAPACITORS
GMK325 (1210)
3.2M0.30 f0.126M0.012g
2.5M0.20 f0.098M0.008g
1. M0.2mm Note:
2. M0.15mm
1. Including dimension tolerance M0.2mm (M0.008inch). 2. Inclulding dimension tolerance M0.15mm (M0.006inch).
GMK432 (1812) GMK550 (2220)
4.5M0.40 f0.177M0.016g 5.7M0.40 f0.224M0.016g
3.2M0.30 f0.126M0.012g 5.0M0.3 f0.197M0.012g
UnitDmm (inch)
AVAILABLE CAPACITANCE RANGE
General Multilayer Ceramic Capacitors
Low profile Multilayer Ceramic Capacitors
Temperature characteristics Temp. char.Code Applicable standard hCi Temperature range hCi Ref. Temp. hLi Capacitance change
hLi Capacitance tolerance
tandhLi Dissipation factor
BJ F
JIS EIA JIS EIA
BJ X7R* F Y5V
K25V85 K55V125 K25V85 K30V85
20 25 20 25
M10 M15
J30 K80 J22 K82
M20fMg M10fKg
J80 fZg K20
2.5%max.** 7.0%max.***
HSome exceptions apply. Refer to the available capacitance range table for the parts which are only available in X5R. HH3.5LmaxDLMKtype ; 107type fCT0.47AFg, 212type fCT1.0AFg, 316N325N432type EMKtype ; 107N212N316N325type TMKtype ; 316type fCX0.47AFg, 325type, 432type GMKtype ; 212type, 316type, 325type UMKtype ; 212type fCX0.1AFg, 316type fCU0.47AFg, 325type HH5.0LmaxDJMKtype ; 107type, 212type, 316type, 325type, 432type, 550type LMKtype ; 107type fCX0.47AFg, 212type fCU2.2AFg
HH10LmaxDAMKtype ; 212type HHH9LmaxD LMKtype ; 212type, 316type fCW10AFg 316type fCW4.7AFg UMKtype ; 325type 16LmaxDJMKtype ; 107N212N316N325N432type LMKtype ; 107N325N432, 316type fCX10AFg
Selection Guide
Part Numbers
Electrical Characteristics
Packaging
Reliability Data
Precautions
P.8
etc
P.40
P.44
P.78
P.80
P.86
39
General Multilayer Ceramic Capacitors
PART NUMBERS
F107TYPE (0603 case size) tan Capacitance Ordering code TMK107BJ223G A EMK107BJ333G A EMK107BJ473G A EMK107BJ683G A EMK107BJ104G A LMK107BJ154G A LMK107BJ224G A LMK107BJ334G A LMK107BJ474G A LMK107BJ684G A JMK107BJ105G A EMK107F224ZA EMK107F474ZA LMK107F105ZA JMK107F225ZA [AF] Temperature characteristics Soldering method Dissipation R: Reflow soldering Capacitance factor W: Wave soldering tolerance [L]Max. 2.5 Thickness [mm] (inch)
RatedVoltage 25V
16V
10V
6.3V 16V 10V 6.3V G
0.022 0.033 0.047 0.068 BJ/X7R 0.1 3.5 0.15 0.22 0.33 0.47 BJ/X5R 0.68 5 1.0 0.22 7 0.47 F/Y5V 1.0 16 2.2 G Please specify the capacitance tolerance code.
R,W
M10L M20L
0.8M0.10 (0.031M0.004)
R
R,W R
J80L K20L
0.8M0.10 (0.031M0.004)
F212TYPE (0805 case size) tan Capacitance [AF] 0.022 0.033 0.047 0.068 0.1 0.15 0.22 0.33 0.047 0.068 0.15 0.22 0.33 0.47 0.68 1.0 0.68 1.0 2.2 3.3 4.7 10 0.22 0.47 1.0 1.0 2.2 4.7 10 Temperature characteristics Soldering method Dissipation R: Reflow soldering Capacitance factor W: Wave soldering tolerance [L]Max. Thickness [mm] (inch)
RatedVoltage
Ordering code UMK212BJ223GD UMK212BJ333GD UMK212BJ473GG UMK212BJ683GG UMK212BJ104GG UMK212BJ154GG GMK212BJ224GG GMK212BJ334GG TMK212BJ473GD TMK212BJ683GD EMK212BJ154GG EMK212BJ224GG EMK212BJ334GG EMK212BJ474GG EMK212BJ684GG EMK212BJ105GG LMK212B J684GG LMK212B J105GG LMK212B J225MG JMK212B J335MG JMK212B J475MG AMK212BJ106MG UMK212F224ZD UMK212F474ZG UMK212F105ZG EMK212F105ZG EMK212F225ZG LMK212F475ZG JM K 2 1 2 F1 0 6 Z G
0.85M0.1 (0.033M0.004) 2.5 1.25M0.1 (0.049M0.004) 3.5 BJ/X7R 2.5 R,W M10L M20L 0.85M0.1 (0.033M0.004)
50V
35V 25V
16V
3.5 BJ/X5R BJ/X7R
1.25M0.1 (0.049M0.004)
10V
6.3V 4V 50V
BJ/X5R
5 10
R
M20L
1.25M0.15 (0.049M0.006) 1.25M0.20(0.049M0.008) 0.85M0.1(0.033M0.004)
7 F/Y5V 9 16
R,W
16V 10V 6.3V G
J80L K20L
1.25M0.1 (0.049M0.004)
R
G Please specify the capacitance tolerance code.
40
PART NUMBERS
F316TYPE(1206 case size) tan Capacitance Ordering code UMK316BJ154G F UMK316BJ224G L UMK316BJ474G L GMK316BJ684G L GMK316BJ105G L TMK316BJ154G D TMK316BJ224G F TMK316BJ334G F TMK316BJ474G L TMK316BJ684G L TMK316BJ105G L EMK316BJ684G F EMK316BJ105G F EMK316BJ225 ML EMK316BJ335ML EMK316BJ475ML LMK 316BJ335 ML LMK 316BJ475 ML JMK316BJ106ML UM K 3 1 6 F 2 2 5 Z G GMK316F225ZG GMK316F475ZG TMK316F225ZG TMK316F475ZG LMK316F106ZL LMK316F226ZL [AF] 0.15 0.22 0.47 0.68 1.0 0.15 0.22 0.33 0.47 0.68 1.0 0.68 1.0 2.2 3.3 4.7 3.3 4.7 10 2.2 2.2 4.7 2.2 4.7 10 22 Temperature characteristics Soldering method Dissipation R: Reflow soldering Capacitance factor W: Wave soldering tolerance [L]Max. 2.5 Thickness [mm] (inch)
RatedVoltage
1.15M0.1 (0.045M0.004)
50V
35V
3.5
1.6M0.2 (0.063M0.008)
4
CAPACITORS
0.85M0.1 (0.033M0.004) BJ/X7R 2.5 R,W M10L M20L 1.15M0.1 (0.045M0.004)
25V
1.6M0.2 (0.063M0.008)
1.15M0.1 (0.045M0.004)
16V
BJ/X5R BJ/X7R BJ/X5R
3.5 M20L R 5 R,W 7 R R,W R J80L K20L00 1.25M0.1 (0.049M0.004) 1.6M0.2 (0.063M0.008)
10V 6.3V 50V 35V 25V 10V G
F/Y5V 9 16
1.6M0.2 (0.063M0.008)
G Please specify the capacitance tolerance code.
F325TYPE(1210 case size) tan Capacitance Ordering code UMK325BJ105GH GMK325BJ155MN GMK325BJ225MN TMK325BJ335MN TMK325BJ475MN EMK325BJ475MN EMK325BJ106MN LMK325BJ106MN JMK325BJ226MM UMK325F475ZH GMK325F106ZH TMK325F106ZH LMK325F226ZN JMK325F476ZN [AF] 1.0 1.5 2.2 3.3 4.7 4.7 10 10 22 4.7 10 10 22 47 F/Y5V Temperature characteristics BJ/X7R BJ/X5R BJ/X7R BJ/X5R BJ/X7R BJ/X5R BJ/X7R BJ/X5R 5 9 7 16 1.5M0.1 (0.059M0.004) R J80L K20L 1.9M0.2 (0.075M0.008) 2.5M0.2 (0.098M0.008) 3.5 R M20L 1.9M0.2 (0.075M0.008) Soldering method Dissipation R: Reflow soldering Capacitance factor W: Wave soldering tolerance [L]Max. M10L M 20L R,W Thickness [mm] (inch)
RatedVoltage 50V 35V 25V 16V 10V 6.3V 50V 35V 25V 10V 6.3V G
1.5M0.1 (0.059M0.004)
G Please specify the capacitance tolerance code.
41
PART NUMBERS
F432TYPE(1812 case size) tan Capacitance Ordering code TMK432BJ106MM LMK432BJ226MM JMK432BJ476MM LMK432F476ZM JMK432F107ZM [AF] 10 22 47 47 100 F/Y5V BJ/X5R 5 16 R J80L K20L 2.5M0.2 (0.098M0.08) Temperature characteristics Dissipation factor [L]Max. 3.5 R Soldering method R: Reflow soldering Capacitance W: Wave soldering tolerance M20L Thickness [mm] (inch)
RatedVoltage 25V 10V 6.3V 10V 6.3V
2.5M0.2 (0.098M0.008)
F550TYPE(2220 case size) tan Capacitance Ordering code JMK550BJ107MM [AF] 100 Temperature characteristics BJ/X5R Dissipation factor [L]Max. 5 Soldering method R: Reflow soldering Capacitance W: Wave soldering tolerance R M20L Thickness [mm] (inch)
RatedVoltage 6.3V
2.5M0.2 (0.098M0.008)
42
Low profile Multilayer Ceramic Capacitors
PART NUMBERS
F212TYPE(0805 case size) tan Capacitance Ordering code EMK212BJ474 D EMK212BJ684 D LMK212BJ105 D LMK212F225ZD JMK212F475ZD [AF] 0.47 0.68 1.0 2.2 4.7 F/Y5V 9 16 BJ/X7R 3.5 Temperature characteristics Dissipation factor [L]Max. Soldering method R: Reflow soldering Capacitance W: Wave soldering tolerance R, W R R M10L M20L J80L K20L 0.85M0.1 (0.033M0.004) Thickness [mm] (inch)
RatedVoltage 16V 10V 10V 6.3V G
0.85M0.1 (0.033M0.004)
4
CAPACITORS
F316TYPE(1206 case size) tan Capacitance Ordering code LMK316BJ225MD LMK316BJ335MF JMK316BJ335MD 6.3V JMK316BJ475MD JMK316BJ685MF 10V 6.3V LMK316F475ZD LMK316F106ZF JMK316F106ZD [AF] 2.2 3.3 3.3 4.7 6.8 4.7 10 10 F/Y5V 9 16 R J80L K20L BJ/X5R 5 1.15M0.1 (0.045M0.004) 0.85M0.1 (0.033M0.004) 1.15M0.1 (0.045M0.004) 0.85M0.1 (0.033M0.004) R M20L Temperature characteristics BJ/X7R Dissipation factor [L]Max. 3.5 Soldering method R: Reflow soldering Capacitance W: Wave soldering tolerance Thickness [mm] (inch)
RatedVoltage 10V
0.85M0.1 (0.033M0.004) 1.15M0.1 (0.045M0.004) 0.85M0.1 (0.033M0.004)
F325TYPE(1210 case size) tan Capacitance Ordering code LMK325BJ335MD LMK325BJ475MF JMK325BJ106MF JMK325BJ106MD EMK325F106ZF LMK325F226ZF [AF] 3.3 4.7 10 10 10 22 F/Y5V 7 16 J80L R K20L BJ/X5R 5 Temperature characteristics BJ/X7R Dissipation factor [L]Max. 3.5 R Soldering method R: Reflow soldering Capacitance W: Wave soldering tolerance M20L Thickness [mm] (inch)
RatedVoltage 10V 6.3V 16V 10V
0.85M0.1 (0.033M0.004) 1.15M0.1 (0.045M0.004) 0.85M0.1 (0.033M0.004) 1.15M0.1 (0.045M0.004)
43
ELECTRICAL CHARACTERISTICS
YESR- Y
Example of Impedance ESR vs. Frequency characteristics (Taiyo Yuden multilayer ceramic capacitor)
44
ELECTRICAL CHARACTERISTICS
4
CAPACITORS
45
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value Item Temperature Compensating (Class 1) Standard 1.Operating Temperature Range 2.Storage Temperature Range 3.Rated Voltage 50VDC,25VDC, 16VDC 16VDC K55 to J125C K55 to J125C High Frequency Type High Permitivity (Class 2) Standard Note1 BDK55 to J125C FDK25 to J85C BDK55 to J125C FDK25 to J85C 50VDC,25VDC 50VDC,35VDC,25VDC 16VDC,10VDC,6.3VDC 4DVC 4.Withstanding Voltage Between terminals No breakdown or damage No abnormality No breakdown or damage Applied voltage: Rated voltageP3 (Class 1) Rated voltageP2.5 (Class 2) Duration: 1 to 5 sec. K25 to J85C High Value K25 to J85C Test Methods and Remarks
1/3
High Capacitance Type BJfX7RgDK55 to J125C BJfX5RgDK55 to J85C BFfY5VgDK30 to J85C High Capacitance Type BJfX7RgDK55 to J125C BJfX5RgDK55 to J85C BFfY5VgDK30 to J85C
4
CAPACITORS
Charge/discharge current: 50mA max. (Class 1,2)
5.Insulation Resistance
10000 ME min.
500 ME A F. or 10000 ME ., whichever is the Applied voltage: Rated voltage smaller. Note 4 Duration: 60M5 sec. Charge/discharge current: 50mA max. BJDM10L, M20L FDK20 %
J80
6.Capacitance (Tolerance)
0.5 to 5 pF: M0.25 pF 1 to 10pF: M0.5 pF 5 to 10 pF: M1 pF 11 pF or over: M 5% M10% 105TYPERQ, SQ, TQ, UQ only 0.5 2pF: M0.1pF 2.2 20pF: M5%
0.5 to 2 pF : M0.1 pF 2.2 to 5.1 pF : M5%
B: M10%, M20% FDK20 %
J80
Measuring frequencyD Class1D 1 HzM10%fCT1000pFg 1 HzM10%fCX1000pFg Class2D 1 HzM10%fCT22AFg 120HzM10HzfCX22AFg Measuring voltageD Class1D0.5V5VrmsfCT1000pFg 1M0.2VrmsfCX1000pFg Class2D 1M0.2VrmsfCT22AFg 0.5M0.1VrmsfCX22AFg Bias application: None
7.Q or Tangent of Loss Angle (tan d)
Under 30 pF : QU400 + 20C 30 pF or over : QU1000 C= Nominal capacitance
Refer to detailed speci- B: 2.5% max.(50V, 25V) BJ: 2.5% max.(50V, 35V, 25V) Multilayer: Measuring frequencyD fication F: 5.0% max. (50V, 25V) 3.5% max. F Class1D 1 HzM10%fCT1000pFg 5.0% max. F 1 HzM10%fCX1000pFg Class2D 1 HzM10%fCT22AFg 10.0% max. F 120HzM10HzfCX22AFg F: 7.0% max. Measuring voltageD 5.0% max. F Class1D0.5V5VrmsfCT1000pFg 1M0.2VrmsfCX1000pFg 9.0% max. F Class2D 1M0.2VrmsfCT22AFg 11.0% max. F 0.5M0.1VrmsfCX22AFg 16.0% max. F Bias application: None High-Frequency-Multilayer: 20.0% max. F Measuring frequency: 1GHz F See Table.1 Measuring equipment: HP4291A Measuring jig: HP16192A
8.Temperature Characteristic of Capacitance
(Without voltage application)
CKD0M250 CJD0M120 CHD0M60 CGD0M30 PKDK150M250 PJDK150M120 PHDK150M60 RKDK220M250 RJDK220M120 RHDK220M60 SKDK330M250 SJDK330M120 SHDK330M60 TKDK470M250 TJDK470M120 THDK470M60 UKDK750M250 UJDK750M120 SLD +350 to -1000 (ppm/C)
CHD0M60 RHDK220M60 fppm/Cg
BDM10LfK25V85Cg FD K80 LfK25V85Cg BfX7RgDM15L FfY5VgDK82 L
J22 J30
BJDM10LfK25V85Cg FDK80 L fK25V85Cg BJfX7R,X5RgDM15L FfY5VgDK82 L
J22 J30
According to JIS C 5102 clause 7.12. Temperature compensating: Measurement of capacitance at 20C and 85C shall be made to calculate temperature characteristic by the following equation. (C 85 - C 20 ) C 20 P QT P 10
6
(ppm/C)
High permitivity: Change of maximum capacitance deviation in step 1 to 5 Temperature at step 1: +20C Temperature at step 2: minimum operating temperature Temperature at step 3: +20C (Reference temperature) Temperature at step 4: maximum operating temperature Temperature at step 5: +20C Reference temperature for X7R, X5R and Y5V shall be +25C
9.Resistance to Flexure of Substrate
Appearance: No abnormality Capacitance change: Within M5% or M0.5 pF, whichever is larger.
Appearance: No abnormality
Appearance: No abnormality
Capacitance change: Capacitance change: WithinM0.5 pF B, BJ: Within M12.5% F: Within M30%
Warp: 2mm Testing board: paper-phenol substrate Thickness: 1.6mm The measurement shall be made with board in the bent position.
81
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value Item Temperature Compensating (Class 1) Standard 10.Body Strength High Frequency Type No mechanical damage. High Permittivity (Class 2) Standard Note1 High Value High Frequency Multilayer: Applied force: 5N Duration: 10 sec. Test Methods and Remarks
2/3
4
CAPACITORS
11.Adhesion of Electrode
No separation or indication of separation of electrode.
Applied force: 5N Duration: 30M5 sec.
12.Solderability
At least 95% of terminal electrode is covered by new solder.
Solder temperature: 230M5C Duration: 4M1 sec.
13.Resistance to soldering
Appearance: No abnormality Capacitance change:
Appearance: No abnor- Appearance: No abnormality mality Capacitance change: tan d: Initial value Insulation resistance: Initial value Capacitance change: Within M7.5% (B, BJ) Within M20% (F)
Preconditioning: Thermal treatment (at 150C for 1 hr) (Applicable to Class 2.) Solder temperature: 270M5C Duration: 3M0.5 sec. Preheating conditions: 80 to 100C, 2 to 5 min. or 5 to 10 min. 150 to 200C, 2 to 5 min. or 5 to 10 min. Recovery: Recovery for the following period under the standard condition after the test. 24M2 hrs (Class 1) 48M4 hrs (Class 2)
W i t h i n M 2 . 5 % o r Within M2.5% M0.25pF, whichever is Q: Initial value larger. Q: Initial value Insulation resistance: Initial value Withstanding voltage (between terminals): No abnormality
Insulation resistance: Withstanding voltage (between terminals): No Initial value Withstanding voltage (between terminals): No abnormality abnormality
14.Thermal shock
Appearance: No abnormality Capacitance change:
Appearance: No abnor- Appearance: No abnormality mality Capacitance change: tan d: Initial value Insulation resistance: Initial value Capacitance change: Within M7.5% (B, BJ) Within M20% (F)
Preconditioning: Thermal treatment (at 150C for 1 hr) (Applicable to Class 2.) Conditions for 1 cycle: Step 1: Minimum operating temperature 30M3 min. Step 2: Room temperature 15 min.
W i t h i n M 2 . 5 % o r Within M0.25pF M0.25pF, whichever is Q: Initial value larger. Q: Initial value Insulation resistance: Initial value Withstanding voltage (between terminals): No abnormality
Insulation resistance: Withstanding voltage (between terminals): No Step 3: Maximum operating temperature 30M3 min. Initial value Withstanding voltage (between terminals): No abnormality abnormality Step 4: Room temperature Number of cycles: 5 times Recovery after the test: 24M2 hrs (Class 1) 48M4 hrs (Class 2) 15 min.
15.Damp Heat (steady state)
Appearance: No abnormality Capacitance change: Within M5% or M0.5pF, whichever is larger. Q: CU30 pF 10TC + 2.5C C 10 pF : QU200 + : QU350
Appearance: No abnor- Appearance: No abnormality mality
Appearance: No abnormality Capacitance change: BJ: Within M12.5% F: Within M30% tan d: BJ: 5.0% max. 7.5% max.F 20.0% max.F
MultilayerD Preconditioning: Thermal treatment (at 150C for 1 hr) (Applicable to Class 2.) Temperature: 40M2C Humidity: 90 to 95% RH Duration: 500 K0 hrs Recovery: Recovery for the following period under the standard condition after the removal from test chamber. 24M2 hrs (Class 1) 48M4 hrs (Class 2) High-Frequency Multilayer: Temperature: 60M2C Humidity: 90 to 95% RH
+24 Duration: 500 K0 hrs +24
Capacitance change: Capacitance change: Within M0.5pF, Insulation resistance: 1000 ME min. B: Within M12.5% F: Within M30% tan d: B: 5.0% max. F: 7.5% max.
30 pF: QU275 Insulation resistance: 50 ME A F or 1000 ME whichever is smaller.
F: 11.0% max. 7.5% max.F 16.0% max.F 19.5% max.F 25.0% max.F FSee Table.2 Insulation resistance: 50 MEAF or 1000 ME whichever is smaller.
10C C: Nominal capacitance Insulation resistance: 1000 ME min.
Recovery: Recovery for the following period under the standard condition after the removal from test chamber. 24M2 hrs (Class 1)
83
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value Item Temperature Compensating (Class 1) Standard 16.Loading under Damp Heat Appearance: No abnormality Capacitance change: Within M 7.5% or M0.75pF, whichever is larger. Q: CU30 pF: QU200 C 30 pF: QU 100 + High Frequency Type High Permittivity (Class 2) Standard Note1 High Value Appearance: No abnor- According to JIS C 5102 Clause 9. 9. mality Multilayer: Test Methods and Remarks
3/3
Appearance: No abnor- Appearance: No abnormality Capacitance change: CT2 pF: Within M0.4 pF CX2 pF: Within M0.75 pF CD Nominal capacitance Insulation resistance: Insulation resistance: 25 MEAF or 500 ME, whichever is the smaller. mality Capacitance change: B: Within M12.5% F: Within M30% tan d: B: 5.0% max. F: 7.5% max.
Capacitance change: Preconditioning: Voltage treatment (Class 2) BJ: Within M 12.5% (50V, 35V, 25V) Within M 15.0% (16V and under) F: Within M30% tan d: BJ: 5.0% max. 7.5% max.F 20.0% max.F F: 11.0% max. 7.5% max.F Temperature: 40M2C Humidity: 90 to 95% RH Duration: 500 +24 hrs K0 Applied voltage: Rated voltage Charge and discharge current: 50mA max. (Class 1,2) Recovery: Recovery for the following period under the standard condition after the removal from test chamber. 24M2 hrs (Class 1) 48M4 hrs (Class 2) High-Frequency Multilayer:
4
CAPACITORS
10C/3
CD Nominal capaci- 500 ME min. tance Insulation resistance: 500 ME min.
16.0% max.F Temperature: 60M2C 19.5% max.F Humidity: 90 to 95% RH 25.0% max.F Duration: 500 FSee Table.2
+24
K0
hrs
Applied voltage: Rated voltage
Insulation resistance: Charge and discharge current: 50mA max. 25 MEAF or 500 ME, Recovery: 24M2 hrs of recovery under the standard condiwhichever is the smaller. 17.Loading at High Temperature Appearance: No abnormality Capacitance change: Within M3% or M0.3pF, whichever is larger. Q: CU30 pF : QU350 10TC 30 pF: QU275 + 2.5C C 10 pF: QU200 + Appearance: No abnor- Appearance: No abnormality Capacitance change: Within M3% or M0.3pF, whichever is larger. Insulation resistance: 1000 ME min. mality Capacitance change: B: Within M12.5% F: Within M30% tan d: B: 4.0% max. F: 7.5% max. Insulation resistance: 50 MEAF or 1000 ME, whichever is smaller. Appearance: No abnormality Capacitance change: BJ: Within M12.5% F: Within M30% tan d: 5.0% max. 7.5% max.F 20.0% max.F F: 11.0% max. 7.5% max.F 16.0% max.F 19.5% max.F 25.0% max.F FSee Table.2 Insulation resistance: 50 MEAF or 1000 ME, whichever is smaller. tion after the removal from test chamber. According to JIS C 5102 clause 9.10. Multilayer: Preconditioning: Voltage treatment (Class 2) Temperature:125M3CfClass 1, Class 2: B, BJfX7Rgg 85M2C (Class 2: BJ,F)
+48 Duration: 1000 K0 hrs
Applied voltage: Rated voltageP2 Recovery: Recovery for the following period under the standard condition after the removal from test chamber. As for Ni product, thermal treatment shall be performed prior to the recovery. 24M2 hrs (Class 1) 48M4 hrs (Class 2) High-Frequency Multilayer: Temperature: 125M3C (Class 1) Duration: 1000 +48 hrs K0 Applied voltage: Rated voltageP2 Recovery: 24M2 hrs of recovery under the standard condition after the removal from test chamber.
10C CD Nominal capacitance Insulation resistance: 1000 ME min.
Note 1: For 105 type, specified in "High value". Note 2: Thermal treatment (Multilayer): 1 hr of thermal treatment at 150 J0 /K10 C followed by 48M4 hrs of recovery under the standard condition shall be performed before the measurement. Note 3: Voltage treatment (Multilayer): 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 48M4 hrs of recovery under the standard condition shall be performed before the measurement. Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35C of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 65 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." Note 4: Specified value for Instration Resistance of JMK212BJ475M only: 100MEAF or more. Table. 1 tand(D. F.) Item BJ: LMK type; 063 type 105 type (CT0.047AF) 107 type (CT0.47AF) 212 type (CT1AF) 316 / 325 / 432 type EMK type; 105 / 107/ 212 / 316 / 325 type TMK type; 316 type(C > 0.47AF) 325 / 432 type GMK type;212 type (CU0.22AF) 316 type (CU0.68AF) 325 type UMK type;212 type (C > 0.1AF) 316 type (CU0.47AF) 325 type (C T1AF) BJ: JMK type LMK type; 105 type (CU0.056AF) 107 type (C > 0.47AF) 212 type (C > 1AF) J4K, E4K type F: 105 type (50V, 25V) F: LMK type; 212 type 316 type (CW10AF)D (CW4.7AF)D 325 type (C > 10AF) EMK type; 105 type (C U0.068AF) UMK type; 325 type (C U4.7AF) BJ: AMK type F: LMK type; 105 type (C W0.22AF) F: JMK type; 105 / 107 / 212 / 316 / 325 / 432 type LMK type; 107 type,325 type 432 type,316 type (C > 10AF) E4K type F: AMK type tand Table. 2 tand(D. F.) Item BJ: JMK type LMK type; 063 type 105 type (CU0.056AF) 107 type (CU0.47AF) 212 type (C > 1AF) J4K, E4K type F: 105 type(50V, 25V) F: LMK type; 105 type (CW0.22AF) F: JMK type; 105 / 107 / 212 / 316 / 325 / 432 type LMK type; 107 type 432 type E4K type BJ: AMK type F: AMK type tand
7.5% max.
3.5%max.
16.0% max. 19.5% max.
5.0% max.
20.0% max. 25.0% max.
9.0% max. 10.0% max. 11.0% max. 16.0% max. 20.0% max.
85
PACKAGING
1 F Standard quantity Bulk packaging fEIAg Type
GMK105f0402g E VK105f0402g GMK107f0603g
2
Taping material
Thickness mmfinchg
0.5 f0.020g 0.8 f0.031g 0.85 f0.033g 1.25 f0.049g 0.85 f0.033g 0.85 f0.033g 1.15 f0.045g 1.25 f0.049g 1.6 f0.063g 1.15 f0.045g 0.85 f0.033g 1.15 f0.045g 1.5 f0.059g 1.9 f0.075g 2.5 f0.098g
code
Standard quantity [pcs] [pcs]
V W A Z D G D D F G L F D F H N M 1000
GMK212f0805g
G4K212f0805g
GMK316f1206g
G4K316f1206g
GMK325f1210g
F fEIAg Type
Taped packaging Thickness mmfinchg
code
Standard quantity [pcs]
paper Embossed tape
GMK063f0201g GMK105f0402g E VK105f0402g GMK107f0603g
0.3 f0.012g 0.5 f0.020g 0.8 f0.031g 0.85 f0.033g 1.25 f0.049g 0.85 f0.033g 0.85 f0.033g 1.15 f0.045g 1.25 f0.049g 1.6 f0.063g 1.15 f0.045g 0.85 f0.033g 1.15 f0.045g 1.5 f0.059g 1.9 f0.075g 2.5 f0.098g 2.5 f0.098g 2.5 f0.098g
P V W A Z D G D D F
15000 10000 4000 4000 E 4000 4000 E
E E E E 3 3000 E E 3000 Bulk Cassette
GMK212f0805g
G4K212f0805g
GMK316f1206g
G L E F D F H N M M M E E E 500 500 500 UnitDmm finchg 105, 107, 212 Please contact any of our offices for accepting your requirement according to dimensions 0402, 0603, 0805.(inch) E 2000 2000
G4K316f1206g
GMK325f1210g
GMK432f1812g GMK550f2220g
78
PACKAGING
3
Taping dimensions Paper Tape 8mm f0.315inches wideg
Embossed tape 12mm
f0.472inches wideg
4
CAPACITORS CAPACITORS
Type fEIAg Chip Cavity Insertion Pitch Tape Thickness T 0.42M0.02 A B F 0.37M0.065 0.67M0.065 52.0M0.05 f0.06M0.002g GMK105f0402g VK105f0402g GMK107f0603g GMK212f0805g G4K212f0805g GMK316f1206g 0.65M0.15 1.0M0.2 1.65M0.25 2.0M0.2 1.15M0.15 1.8M0.2 2.4M0.2 3.6M0.2 UnitDmmfinchg 4.0M0.1 1.1max. f0.043max.g 4 52.0M0.05
Type fEIAg A 3.7M0.2 f0.146M0.008g 5.4M0.2 f0.213M0.008g Chip cavity B 4.9M0.2 f0.193M0.008g 6.1M0.2 f0.240M0.008g Insertion Pitch Tape Thickness F 8.0M0.1 K T
GMK063f0201g
f0.027M0.002g f0.079M0.002g f0.017M0.001g 0.8max.
GMK432f1812g
3.4max. 0.6max.
f0.315M0.004g f0.134max.g f0.024max.g 8.0M0.1 3.5max. 0.6max.
f0.026M0.004g f0.045M0.004g f0.079M0.002g f0.031max.g GMK550f2220g f0.039M0.008g f0.071M0.008g f0.065M0.008g f0.094M0.008g f0.157M0.004g f0.079M0.008g f0.142M0.008g f0.315M0.004g f0.138max.g f0.024max.g UnitDmmfinchg Leader and Blank portion
Embossed tape 8mm
f0.315inches wideg
5
Reel size
Type fEIAg A GMK212f0805g 1.65M0.25 Chip cavity B 2.4M0.2 Insertion Pitch Tape Thickness F K T
f0.065M0.008g f0.094M0.008g GMK316f1206g G4K316f1206g GMK325f1210g 2.0M0.2 3.6M0.2 4.0M0.1 2.5max. 0.6max
f0.079M0.008g f0.142M0.008g f0.157M0.004g f0.098max.g f0.024max.g 2.8M0.2 3.6M0.2 3.4max. f0.134max.g UnitDmmfinchg 6 Top Tape Strength
f0.110M0.008g f0.142M0.008g
0.1 0.7N The top tape requires a peel-off force of 0.1V0.7N in the direction of the arrow as illustrated below.
79
PRECAUTIONS
1/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages 1.Circuit Design Precautions Verification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any capacitors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. Technical considerations
4
CAPACITORS
Operating Voltage (Verification of Rated voltage) 1. The operating voltage for capacitors must always be lower than their rated values. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages should be lower than the rated value of the capacitor chosen. For a circuit where both an AC and a pulse voltage may be present, the sum of their peak voltages should also be lower than the capacitor's rated voltage. 2. Even if the applied voltage is lower than the rated value, the reliability of capacitors might be reduced if either a high frequency AC voltage or a pulse voltage having rapid rise time is present in the circuit. 1.The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amourts.flarger fillets which extend above the component end terminationsg Examples of improper pattern designs are also shown.
2.PCB Design
Pattern configurations (Design of Land-patterns) 1. When capacitors are mounted on a PCB, the amount of solder used (size of fillet) can directly affect capacitor performance. Therefore, the following items must be carefully considered in the design of solder land patterns: (1) The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. (2) When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist.
(1) Recommended land dimensions for a typical chip capacitor land patterns for PCBs
Recommended land dimensions for wave-soldering (unit: mm) Type L Size A B C W 107 1.6 0.8 0.8V1.0 0.5V0.8 0.6V0.8 212 2.0 51.25 1.0V1.4 0.8V1.5 0.9V1.2 316 3.2 1.6 1.8V2.5 0.8V1.7 1.2V1.6 325 3.2 2.5 1.8V2.5 0.8V1.7 1.8V2.5
Recommended land dimensions for reflow-soldering (unit: mm) Type Size A B C L W 063 0.6 0.3 105 1.0 0.5 107 1.6 0.8 212 2.0 51.25 316 3.2 1.6 325 3.2 2.5 432 4.5 3.2 550 5.7 5.0
0.20V0.30 0.45V0.55 0.6V0.8 0.8V1.2 1.8V2.5 1.8V2.5 2.5V3.5 3.7V4.7 0.20V0.30 0.40V0.50 0.6V0.8 0.8V1.2 1.0V1.5 1.0V1.5 1.5V1.8 1.5V2.3 0.25V0.40 0.45V0.55 0.6V0.8 0.9V1.6 1.2V2.0 1.8V3.2 2.3V3.5 3.5V5.5
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns.
Type
316
4 circuits 3.2 1.6 0.7V0.9 1 0.4V0.5 0.8
212 4 circuits 2.0 1.25 0.5V0.6 0.5V0.6 0.2V0.3 0.5
Size
L W a b c d
87
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages 2.PCB Design Precautions Technical considerations (2) Examples of good and bad solder application Items Not recommended Recommended
2/6
Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded components near mounted components Horizontal component placement
4
CAPACITORS
Pattern configurations (Capacitor layout on panelized [breakaway] PC boards) 1. After capacitors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes (PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.) For this reason, planning pattern configurations and the position of SMD capacitors should be carefully performed to minimize stress.
1-1. The following are examples of good and bad capacitor layout; SMD capacitors should be located to minimize any possible mechanical stresses from board warp or deflection.
Not recommended
Recommended
Deflection of the board
1-2. To layout the capacitors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on capacitor layout. The example below shows recommendations for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD capacitor layout must also consider the PCB splitting procedure.
89
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages 3.Considerations for automatic placement Precautions Adjustment of mounting machine 1. Excessive impact load should not be imposed on the capacitors when mounting onto the PC boards. 2. The maintenance and inspection of the mounters should be conducted periodically. Technical considerations
3/6
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the capacitors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: (1)The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. (2)The pick-up pressure should be adjusted between 1 and 3 N static loads. (3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle,
4
CAPACITORS
supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Not recommended
Recommended
Single-sided mounting
Double-sided mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the capacitors because of mechanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically.
Selection of Adhesives 1. Mounting capacitors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded capacitor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use.
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the capacitors may result in stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the following precautions should be noted in the application of adhesives.
(1)Required adhesive characteristics a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive should have sufficient strength at high temperatures. c. The adhesive should have good coating and thickness consistency. d. The adhesive should be used during its prescribed shelf life. e. The adhesive should harden rapidly f. The adhesive must not be contaminated. g. The adhesive should have excellent insulation characteristics. h. The adhesive should not be toxic and have no emission of toxic gasses.
(2)The recommended amount of adhesives is as follows; Figure a b c 212/316 case sizes as examples 0.3mm min 100 V120 Am Adhesives should not contact the pad
91
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages Precautions Selection of Flux 1. Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; (1)Flux used should be with less than or equal to 0.1 wt% (equivelent to chroline) of halogenated content. Flux having a strong acidity content should not be applied. (2)When soldering capacitors on the board, the amount of flux applied should be controlled at the optimum level. (3)When using water-soluble flux, special care should be taken to properly clean the boards. Technical considerations
4/6
4. Soldering
1-1. When too much halogenated substance (Chlorine, etc.) content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the capacitors. 1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
4
CAPACITORS
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
Soldering Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions.
1-1. Preheating when soldering Heating: Ceramic chip components should be preheated to within 100 to 130C of the soldering. Cooling: The temperature difference between the components and cleaning process should not be greater than 100C. Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering [Reflow soldering] Temperature profile
Caution 1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thickness of the capacitor, as shown below:
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible.
[Wave soldering] Temperature profile
Caution 1. Make sure the capacitors are preheated sufficiently. 2. The temperature difference between the capacitor and melted solder should not be greater than 100 to130C 3. Cooling after soldering should be as gradual as possible. 4. Wave soldering must not be applied to the capacitors designated as for reflow soldering only.
93
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages Precautions [Hand soldering] Temperature profile Technical considerations
5/6
4. Soldering
4
CAPACITORS
Caution 1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm. 2. The soldering iron should not directly touch the capacitor. 5.Cleaning Cleaning conditions 1. When cleaning the PC board after the capacitors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of the cleaning (e.g. to remove soldering flux or other materials from the production process.) 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the capacitor's characteristics. (1)Excessive cleaning In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the capacitor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked; Below 20 W/ b Below 40 kHz 1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a degradation of the capacitor's electrical properties (especially insulation resistance). 2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally affect the performance of the capacitors.
Ultrasonic output Ultrasonic frequency
Ultrasonic washing period 5 min. or less
6.Post cleaning processes
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than the capacitor's operating temperature, the stresses generated by the excess heat may lead to capacitor damage or destruction. The use of such resins, molding materials etc. is not recommended.
7.Handling
Breakaway PC boards (splitting along perforations) 1. When splitting the PC board after mounting capacitors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices.
Mechanical considerations 1. Be careful not to subject the capacitors to excessive mechanical shocks. (1)If ceramic capacitors are dropped onto the floor or a hard surface, they should not be used. (2)When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components.
95
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages 8.Storage conditions Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. YRecommended conditions Ambient temperature Humidity Below 40C Below 70% RH Precautions Technical considerations
6/6
1. If the parts are stored in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the capacitors.
4
CAPACITORS
The ambient temperature must be kept below 30C. Even under ideal storage conditions capacitor electrode solderability decreases as time passes, so ceramic chip capacitors should be used within 6 months from the time of delivery. YThe packaging material should be kept where no chlorine or sulfur exists in the air. 2. The capacitance value of high dielectric constant capacitors (type 2 &3) will gradually decrease with the passage of time, so this should be taken into consideration in the circuit design. If such a capacitance reduction occurs, a heat treatment of 150C for 1hour will return the capacitance to its initial level.
97

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